Francoise Von Trapp - Profile and Journalist Details
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Francoise Von Trapp
Verified
Editorial Director, 3D InCites
Phoenix
Beats
Android, tablets sonido, TVsTecnología: smartphones, smartwatches gadgets
I'll take a run at anything and everything
Content
By Francoise Von Trapp Verified| 3D InCites Verified Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
By Francoise Von Trapp Verified| chiplet-marketplace.com@ By Francoise von Trapp, 3DInCItes | April 08, 2025Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
By Francoise Von Trapp Verified| 3D InCites Verified Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting to look at efforts in quantum computing, which seems to be the next big thing after AI.
Company Info
3D InCites
3D InCites is a media outlet established in 2009 by Francoise von Trapp. It focuses on 3D IC technologies and 3D packaging, emphasizing heterogeneous integration and 3D Through-Silicon Vias (TSVs). The platform fosters interaction and participation within the semiconductor and microelectronics industries. 3D InCites offers content and community engagement through its website and podcasts. The 3D InCites Podcast facilitates discussions on relevant industry topics. The organization also hosts the 3D InCites Awards, which recognize contributions in heterogeneous integration, 3D HI, and chiplet technologies, as well as companies with strong workplace cultures. Additionally, it publishes a Yearbook that showcases award finalists and highlights industry achievements. The awards ceremony takes place annually at the IMAPS Device Packaging Conference, reinforcing its ties to the semiconductor and packaging sectors.
Phoenix, United States
+1 512-372-8887
Founded: 2013