Trine Pierik - Profile and Journalist Details
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Verified
Membership Director, 3D InCites
Scottsdale
Beats
Awesome Thats Everything
Content
By Trine Pierik, Fraunhofer IZM, Mosaic Microsystems| 3D InCites Verified IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers,” and a happy hour of networking.
By Trine Pierik| 3D InCites Verified SEMICON Europa 2023, co-located with productronica in Munich, Germany makes for one of the strongest single events for electronics manufacturing in Europe. Together, SEMICON Europa and productronica showcase the entire spectrum of technologies and solutions for the entire semiconductor and electronics manufacturing industries, reflecting the rapid pace of technological development in all areas.
By Trine Pierik, Fraunhofer IZM, Mosaic Microsystems| 3D InCites Verified IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with Adaptive Pad Stacks on Molded Embedded Bridge Die Interposers,” and a happy hour of networking.
Company Info
3D InCites
3D InCites is a media outlet established in 2009 by Francoise von Trapp. It focuses on 3D IC technologies and 3D packaging, emphasizing heterogeneous integration and 3D Through-Silicon Vias (TSVs). The platform fosters interaction and participation within the semiconductor and microelectronics industries. 3D InCites offers content and community engagement through its website and podcasts. The 3D InCites Podcast facilitates discussions on relevant industry topics. The organization also hosts the 3D InCites Awards, which recognize contributions in heterogeneous integration, 3D HI, and chiplet technologies, as well as companies with strong workplace cultures. Additionally, it publishes a Yearbook that showcases award finalists and highlights industry achievements. The awards ceremony takes place annually at the IMAPS Device Packaging Conference, reinforcing its ties to the semiconductor and packaging sectors.
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Founded: 2013